Flexible, fully automatic die attach system controlled by user
friendly Windows XP® based software.
The system is available either installed on its own bench or in "Table-Top" configuration (without bench).
Model 6400 performs cold and hot processes for MCM, Flip Chip,
Eutectic, and Ultrasonic assemblies.
Very high placement accuracy of 3 microns @ 3 sigma (process
dependent) is ensured by the closed loop servo systems and the high resolution digital
Handles active and passive components with sizes between 0.2
mm up to over 25 mm.
Pick from up to thirty 2" or up to nine 4" Waffle or Gel Pak carriers.
Pick from Wafers up to 300 mm
Pick from up to 12 Tape & Reel feeders.
Specializing in unusual die sizes and aspect ratios.
The volumetric or time-pressure dispenser applies adhesive in programmable shapes.
Stamping (Pin Transfer) applies adhesive dots as small as 75
Full Flip Chip capability including chip flipping, bump fluxing and
chip final alignment over up looking camera.
Handles CCD and other sensors, LCD's, MEMS and other sensitive
Unique die staking capability with programmable BLT.