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     Model 6496
   For MCM/Hybrid, Silver Glass and Eutectic die attach

Performs Silver Glass, Eutectic and Ultrasonic assemblies in addition to MCM/Hybrid/COB.

Similar table top design like the 6495, includes additional accessories and software capabilities required for the Silver Glass/Eutectic/Ultrasonic processes.

Software control of Bond Line Thickness, Scrubbing parameters and Ultrasonic parameters.

Pick from 2" or 4" Waffle or Gel-Pak.

Pick from Wafers up to 8" (automatic or manual).

Wafer Mapping capability or Ink Dot recognition.

Eutectic, inert gas cover, high temperature process control.

Accurate Bond Line Thickness control based on the measurement of the substrate height.

Dispensing and stamping (Pin Transfer) of a wide range of adhesives including Epoxies, UV adhesives, RTV's, Silver Glass, etc.

Ideal for low to medium volume production.

Specification Highlights:

- Large 12" x 12" Work Area.
- Handles up to 80 packages at a time.
- Die size: 0.010" to over 1".
- Pick from Waffle/Gel packs and up to 8" Wafers.
- Die Thickness: from 0.002".
- Die Aspect Ratio: over 1:20.
- Die Material: GaAs, Silicon, Glass, other.
- Dispensing and stamping (pin transfer) available.
- Cold or Hot process up to 500 C with Inert Gas cover.
- Ultrasonic die attach available.
- Bond Line Thickness control for Silver Glass applications.
- Die Stacking capability.
- Pickup/Bond Force: 20 3000 grams.
- Placement Accuracy: 30 m @ 3 sigma depending on application.
- Throughput: up to 600 CPH.




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