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Application Request Form


Personal Information:
Name:
Title:
Company:
Phone:
Fax:




Substrate Information:
Product Type:
Number of Components per Unit:
Substrate Material:
Substrate Presentation:
Number of Units per Substrate:
Dimensions:
  w [Inch]:    w [Inch]:    w [Inch]:




Component Information:
 
W [mil]
L [mil]
T [mil]
  Material
Dimensions:

Die Attach Technology:

  Diam. [mil]   Height [mil] Material
Bump Dimensions:
Required Placement Accuracy:
   X [mil]    Y [mil]    Theta [deg]     BLT [mil]
Required Throughput [UPH]:
Additional Information:
     
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