Direct Clip Attach Tools provide efficient solutions for attaching semiconductor clips directly onto substrates or packages. With precise control and adjustable parameters, these tools ensure secure and reliable attachment of semiconductor clips in various applications. Engineered for versatility and ease of use, they streamline the clip attachment process while maintaining consistent bonding quality and integrity.

Clip bonding is an alternative process to wire bonding in microelectronics assembly. Clip bonding provides a secure and robust connection, reducing the risk of mechanical failure. It enables fast production rates, as clips can be attached in parallel, improving manufacturing efficiency. Additionally, clip bonding is ideal for power electronics applications, as it can handle high current and voltage requirements. Clip bonding minimizes the risk of wire sweep or damage during handling, making it a reliable choice for demanding electronic devices.

MPP has recently developed a breakthrough solution for increasing the yield and productivity of the clip bonding process by applying innovative flow dynamics concepts to the dispensing tool design that is used in this process. The main advantages of MPPs innovative design are:

• Faster response to dispensing command
• Improved dispensing precision
• Easier setup
• Extended life of the dispensing tool
• Reduced clogging rate
• Easy adaptation and conversion of legacy designs

MPP’s breakthrough design is already being implemented with leading global power device manufacturers.