Our Fine Wire Wedge Bonding Tools are crafted for delicate bonding applications in semiconductor manufacturing. These tools offer precise control and minimal wire deformation, ideal for bonding fine wires in microelectronics and sensor devices. With advanced features and meticulous engineering, they enable high-yield production of miniaturized electronic components.

• With over 35 years of experience, MPP is a leading supplier of Wedges, Fine Wire Wedges, Ribbon Bonding Wedges, and TAB tools for the microelectronics backend assembly industry.
• MPP tools are compatible with all manual, semi-automatic, and automatic wedge bonder models such as K&S, Hesse, Delvotek, ASM, Palomar and others
• We deliver an unmatched tool-to-tool repeatability to ensure stable bonding results with high yields.
• Continuous development of materials and designs to optimize bonding performance.
• MPP delivers unmatched quality, applying strict quality standards.
• We offer the best cost of ownership through competitive pricing and the shortest lead times.