Our Heavy Wire Wedge Bonding Tools are engineered for robust bonding of thick wires in semiconductor packaging. With superior strength and precision, these tools ensure reliable connections for power devices and high-current applications. Designed for efficiency and durability, they streamline the bonding process while maintaining exceptional bonding quality and consistency.
MPP is a leading manufacturer of Heavy Wire Wedge bonding tools (HWW) and ribbon tools for large manufacturers of power devices for all types of applications, especially: Automotive, Electric Vehicle (EV), and Semiconductors.
All is done in-house and by applying own-designed unique & efficient manufacturing processes, with best in class integrated QC & QA.les MPP to HWW tools with:
MPP’s expert engineering team is continuously working with our customers to support cost reduction projects, better up-time, and improved MTBA, without any compromise on quality and performance.
Special “cost reduction” projects are supported with MPP’s own propriety special tip design, along with own developed special TC material with superior “low build-up” performances.
MPP is working “hand in hand” with leading OEM bonding equipment, and supporting all bonder’s manufacturers – K&S, Cho-Onpa, Hesse, F&S, and others
Altogether, MPP’s solution provides you with the “lowest cost per bond” by delivering:
Quality tools
- Strict QC & QA è High Accuracy & Repeatability
- Top Performances – bonding and life span
- Qualified by leading customers
Excellent product support
- Short lead time
- Attractive prices
- Supporting consignment and other “custom made” solutions
Close and intimate engineering support
- Supporting customer’s inquiries for new designs and applications
- Special tools options for longer life span
- Special marking options – s/n, QR code