The iBond5000 Dual ball and wedge wire bonder is an advanced convertible wedge and ball bonder used for process development, production, research, and supplemental manufacturing support.
The iBond5000 Dual enables ball and wedge wire bonder fine aluminum and gold wire wedge or ribbon bonding utilizing a deep access wire feed system. For gold or copper ball bonding, the system features a Patented N-EFO to generate the ball bond, which is mounted on a unique swing arm assembly, providing simplified changeover between bonding modes, including:
- Ball, Bump & Wedge bonding gold wires: 17-70 microns dia.
- Wedge Bonding Aluminium Wires: 20-75 microns dia.
- Ball bonding of copper and Platinum-Iridium wires
- Ribbon Bonding: 25 x 250-micron gold ribbon.
The iBond5000 Dual enables ball and wedge wire bonder, which based on the proven 4500 Series (the market leader for nearly a decade), provides the high yield and excellent repeatability needed for every wedge and ball bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.
The MPP iBond5000 series integrates the proven MWB mechanical design with an advanced graphic user interface with semi-automatic and manual operation modes, touch-screen interface, individual bond parameter control, program storage, and the capability to handle a wide range of wire diameters, from 18 to 75-micron diameter wire and up to 250 x 25-micron ribbon.
Key Features:
- Overall solution – machine, tools, application development, service
- Silver, Gold, and Platinum service plans
- Trade-in options & Rental options
- 24/7 Online Technical support
- Customized wire bonding profiles
- Ball bonding, bumping, coining, security bond, and Tab bond
- High yield and excellent repeatability for every bonding application including Optoelectronic Modules, Hybrids/MCMs,
- Microwave Products, Chip-on-Boards and more.
- Easy conversion between wedge and ball configuration
- Adjustable work holder height for added flexibility
- Supports a wide range of wire and ribbon size
- Large bondable area: 135 mm x 135 mm (5.3” x 5.3”)
Specifications
iBond5000-Dual
Technical Specifications
| • Ball-wedge and wedge-wedge bonding capability | |
| • Wire feed angle 90 degrees | |
| Gold wire diameter | • Ball bonding and wedge bonding – 0.7 mil to 3.0 mil diameter – 17 micron to 75 micron diameter • Copper Wire – 0.7mil to 2mil -17 micron to 50 micron |
| Gold ribbon | • Wedge bonding – Up to 1 x 10 mil – Up to 25 x 250 micron |
| Aluminum wire diameter | • Wedge bonding – 0.7 mil to 3.0 mil diameter – 20 micron to 75 micron diameter |
| Spool size | • Ball bonding 2” x 1” double flange spool • Wedge bonding – 2” x 1” double flange spool – 1/2” spool (type TS-1) – 2” x 1” spool holder for ribbon |
| Bonding tool specification | • Wedge bonding wedge length – 0.750” using 0.828” set up gauge • Ball bonding capillary lengths – 0.625” |
Machine Specifications
XY Table
| Bonding Area | 135 mm x 135 mm (5.3” x 5.3”) |
| Throat Depth | 143 mm (5.6”) |
| Gross Table Motion | 140 mm (5.5”) |
| Fine Table Motion | 14 mm (0.55”) |
| Mouse Ratio | • Left side mouse with right side manual ‘Z’ lever. – Recommend optional ‘Portable Dials Kit’ – Locates critical dials on right side – For operator comfort (Search 1st , Search 2nd , Loop and Tail) – Right side mouse with left side manual ‘Z’ lever – Right side mouse with integrated manual ‘Z’ lever |
| Motorized Y | • Step back up to 4 mm (160 mil) • Reverse up to 0.25 mm (10 mil) • Kink height up to 0.5 mm (20 mil |
| Z Axis Travel | • 0.500” (12.5 mm) ‘Z’ travel • Increased travel range • Full range of control with the ‘Z’ motor |
| Ultrasonic System | • High Q 60kHz MPP transducer • Phase Lock Loop self-tuning ultrasonic generator |
Parameters
| Low Ultrasonic Power | 1.3 watts |
| High Ultrasonic Power | 3.0 watts |
| Bond Time (Selectable range) | • 10-100 milliseconds • 10-1000 milliseconds |
| Bond Force (Static force adjust) | • 10-120 grams (requires added weights >80 grams) • No springs • Bond Force Coil Range • Added 3-80 grams (depends on Force parameter setting) • Separate 1st bond and 2nd bond parameters • No springs |
| Wire Termination | • Clamp Tear, adjustable ‘Tear’ parameter and ‘Tail’ parameter • Wire tail feed • Programmable clamp motion for wedge bonding • Programmable tail pull for ball bonding |
| Temperature Controller | • Built-in • Range up to 180°C, +/- 5°C |
| Facility Requirements | • Electrical: 100 – 240V, 50 / 60Hz • Dimensions in mm: 680 (27”) W x 700 (27.5”) D x 530 (21”) H • Weight in kg: Shipping: 55 (122 lb), Net: 31 (69 lb) |