The iBond5000-Wedge is an advanced wedge bonder- manual wire bonder- used for process development, production, research, or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.
The MPP iBond5000 series integrates the proven MWB (Manual Wire Bonder) mechanical design with an advanced graphic user interface.
The iBond5000 main control board is based on Cortex A9 Dual-core CPU that runs at a speed of 1GHz, the operating system is Windows CE based and the system is controlled using a 7” 600X800 TFT touch screen.
The system enables you, the user, to save and load profiles; it comes with factory preconfigured profiles to ease usage
The MPP iBond5000 Wire Bonder series is based on the successful K&S 4500 manual wire boner series, the market leader for nearly a decade.
Key Features:
- Overall solution – machine, tools, application development, service
- Silver, Gold, and Platinum service plans
- Trade-in options & rental options
- 24/7 Online Technical support
- Customized wire bonding profiles
- High yield and excellent repeatability for every bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Chip-on-Boards, and more.
- Adjustable work holder height for added flexibility
- Ergonomic design and easy to use
Specifications
iBond5000-Wedge Technical Specifications
| Wire feed angle 90 degrees, vertical feed / wedge 30 degrees, 45 degrees | |
| Gold Wire Diameter | Wedge bonding – 0.7 mil to 3.0 mil diameter – 17 micron to 75 micron diameter Copper Wire – 0.7mil to 2mil -17 micron to 50 micron |
| Gold Ribbon | Wedge bonding – Up to 1 x 10 mil – Up to 25 x 250 micron |
| Aluminum Wire Diameter | Wedge bonding – 0.8 mil to 3.0 mil diameter – 20 micron to 75 micron diameter |
| Spool Size | Wedge bonding – 2” x 1” double flange spool – 1/2” spool (type TS-1) – 2” x 1” spool holder for ribbon |
| Bonding Tool Specification | Wedge bonding wedge length – 0.750” -0.828” -1” |
Machine Specifications
XY Table
| Bonding Area | 135 mm x 135 mm (5.3” x 5.3”) |
| Throat Depth | 143 mm (5.6”) |
| Gross Table Motion | 140 mm (5.5”) |
| Fine Table Motion | 14 mm (0.55”) |
| Mouse Ratio 6:1 (Choose Mouse Type) | • Left side mouse with right side manual ‘Z’ lever. – Recommend optional ‘Portable Dials Kit’ – Locates critical dials on right side – For operator comfort (Search 1st , Search 2nd , Loop and Tail) – Right side mouse with left side manual ‘Z’ lever – Right side mouse with integrated manual ‘Z’ lever |
| Motorized Y | • Stepback up to 4 mm (160 mil) • Reverse up to 0.25 mm (10 mil) • Kink height up to 0.5 mm (20 mil) |
| Z Axis Control | DC Servo with closed loop tachometer feedback |
| Z Axis Travel | • 0.500” (12.5 mm) ‘Z’ travel • Increased travel range • Full range of control with the ‘Z’ motor |
| Ultrasonic System | • High Q 60kHz MPP transducer • Phase Lock Loop self-tuning ultrasonic generator |
Parameters
| Low Ultrasonic Power | 1.3 watts |
| High Ultrasonic Power | 2.5 watts |
| Bond Time (Selectable range) | • 10-100 milliseconds • 10-1000 milliseconds |
| Bond Force (Static force adjust) | • 10-250 grams (requires added weights >80 grams) • No springs • Bond Force Coil Range • Added 3-80 grams (depends on Force parameter setting) • Separate 1st bond and 2nd bond parameters • No springs |
| Wire Termination | • Clamp Tear, adjustable ‘Tear’ parameter and ‘Tail’ parameter • Wire tail feed • Programmable clamp motion for wedge bonding |
| Temperature Controller | • Built-in • Range up to 250 o C, +/- 5 oC |
| Facility Requirements | • Electrical: 100 – 240V, 50 / 60Hz • Dimensions in mm: 680 (27”) W x 700 (27.5”) D x 530 (21”) H • Weight in kg: Shipping: 55 (122 lb), Net: 31 (69 lb) |