Performs MCM/Hybrid/COB, Silver Glass, Eutectic, Ultrasonic and Flip
Chip, processes.
Table top design, semi-automatic operation, includes all required
features for performing flip chip or chip and wire applications.
Full software control, with programmable process parameters such as
Forces, Velocities, times, dispensing, Bond Line Thickness, Scrubbing,
Ultrasonic, Vision, etc.
The only manual action is indexing to the next die to be picked up from
the waffle/Gel pack or the wafer.
Pick from 2″ or 4″ Waffle or Gel-Pak.
Pick from up to 8” wafer
Cold as well as high temperature processes under inert gas cover.
Simple operation, Ideal for low volume production.

Specification Highlights:

• Large 7″ x 12″ Work Area.
• Handles up to 80 packages at a time.
• Die size: 0.010″ to over 1″.
• Pick from Waffle/Gel packs optional Wafer.
• Die Thickness: from 0.002″.
• Die Aspect Ratio: over 1:20.
• Die Material: GaAs, Silicon, Glass, other.
• Dispensing and stamping available.
• Cold or Hot process up to 500 C with Inert Gas cover.
• Ultrasonic die attach available.
• Bond Line Thickness control for Silver Glass applications.
• Die Stacking Capability.
• Pickup/Bond Force: 40 – 3000 grams.
• Placement Accuracy: ±20 µm depending on application and configuration.
• Throughput: up to 500 CPH.