I’ve been working with MAT die bonders for over 15 years, and have been very successful developing multiple IC packaging assembly processes, with various types of products, such as, QFN/PDFN  leadframes, multi-chip (6 die) RF modules, DIP’s, flip chip, dam/fill,  etc….  The MAT machine is very flexible and easy to configure for any package type assembly in the industry.  The epoxy dispense application is very precise, even for 0.075mm thin die.  I highly recommend this machine for all of your IC package assembly development and production needs…..